Compiler Construction'22 - Call for Papers (Seoul, April 2022)

Fernando <pronesto@gmail.com>
Fri, 26 Nov 2021 01:55:21 -0800 (PST)

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Compiler Construction'22 - Call for Papers (Seoul, April 2022) pronesto@gmail.com (Fernando) (2021-11-26)
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From: Fernando <pronesto@gmail.com>
Newsgroups: comp.compilers
Date: Fri, 26 Nov 2021 01:55:21 -0800 (PST)
Organization: Compilers Central
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Keywords: CFP, conference
Posted-Date: 26 Nov 2021 12:32:39 EST

Dear folks,


The deadline for paper submissions is on December 8th, 2021.


Kind regards,


Fernando


----------------


ACM SIGPLAN 2022 International Conference on Compiler Construction (CC 2022)
Co-located with CGO, HPCA, and PPoPP
Sat 2 April - Sun 3 April 2022
Seoul, South Korea
https://conf.researchr.org/home/CC-2022






CALL FOR PAPERS


The International Conference on Compiler Construction (CC) is interested in
work on processing programs in the most general sense: analyzing, transforming
or executing input that describes how a system operates, including traditional
compiler construction as a special case.


=== IMPORTANT DATES ===


        Full Paper Submission: December 8, 2021
        Author Response Period: January 16-20, 2022
        Author Notification: January 31, 2022
        Artifact Submission: February 7, 2022




Original contributions are solicited on the topics of interest which include,
but are not limited to:


        Compilation and interpretation techniques, including program
representation, analysis, and transformation; code generation, optimization,
and synthesis; the verification thereof
        Run-time techniques, including memory management, virtual machines, and
dynamic and just-in-time compilation
        Programming tools, including refactoring editors, checkers, verifiers,
compilers, debuggers, and profilers
        Techniques, ranging from programming languages to micro-architectural
support, for specific domains such as secure, parallel, distributed, embedded
or mobile environments
        Design and implementation of novel language constructs, programming
models, and domain-specific languages


CC is an ACM SIGPLAN conference and implements guidelines and procedures
recommended by SIGPLAN. Prospective authors should be aware of ACM’s
Copyright policies. Proceedings will be made available online in the ACM
digital library from one week before to one week after the conference.


Full CfP: https://conf.researchr.org/track/CC-2022/CC-2022-research-papers






ARTIFACT EVALUATION


Authors of accepted papers will be invited to submit their artifacts for the
Artifact Evaluation (AE). The Artifact Evaluation process begins after the
acceptance notification, and is run by a separate committee whose task is to
assess how the artifacts support the work described in the papers.
To ease the organization of the AE committee, we kindly ask authors to
indicate at the time they submit the paper, whether they are interested in
submitting an artifact.
Papers that go through the Artifact Evaluation process successfully will
receive a seal of approval printed on the papers themselves.
Authors of accepted papers are encouraged, but not required, to make these
materials publicly available upon publication of the proceedings, by including
them as “source materials” in the ACM Digital Library.


CC AE web page:
https://conf.researchr.org/track/CC-2022/CC-2022-research-artifacts






ORGANIZERS


General Chairs:
        Aaron Smith - Microsoft / University of Edinburgh
        Bernhard Egger - Seoul National University


Program Chair:
        Bernhard Egger - Seoul National University


Artifact Evaluation Chair:
        Bruno Bodin - Yale-NUS College


Web Chair:
        Martin Lücke - University of Edinburgh


Steering Committee:
        Björn Franke (Chair) - University of Edinburgh
        Christophe Dubach - University of Edinburgh
        Sebastian Hack - Saarland University
        Manuel Hermenegildo - IMDEA Software Institute and T.U. of Madrid (UPM)
        Alexandra Jimborean - Uppsala University
        Milind Kulkarni - Purdue University
        Louis-Noël Pouchet - Colorado State University
        Peng Wu - Huawei America Research Lab
        Jingling Xue - UNSW Sydney
        Ayal Zaks- Intel Corporation and Technion



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